Nidec Advance Technology Corporation (“Nidec Advance Technology”) announced today its participation in SEMICON China 2025, scheduled for March 26-28, 2025, at the Shanghai New International Expo Centre.
This prominent event, one of the largest semiconductor industry gatherings in China, will feature innovations across chip design, manufacturing, packaging, measurement, equipment, and materials. Over 1,000 companies are anticipated to exhibit in more than 4,500 booths.
Under the theme of “Wafer Testing and Wafer Handling,” Nidec Advance Technology and Nidec Instruments Corporation (“Nidec Instruments”) will jointly present advanced solutions for inspection and product transfer. These include Nidec Advance Technology’s optical visual inspection equipment and probe cards utilized in the wafer manufacturing process, alongside Nidec Instruments’ transfer robots.
Products on Exhibition
Nidec Advance Technology will feature a range of products:
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Optical 2D/3D inspection equipment for semiconductor wafers (RWi300MK series)
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IGBT/SiC power module inspection equipment (NATS series)
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Conduction/short-circuit inspection equipment for semiconductor packages (GATS series)
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Optical 2D/3D inspection equipment for high-density substrates (RSH series)
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Semiconductor wafer inspection probe card Nidec Instruments will display:
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Semiconductor wafer transfer robot (SR8220, SR8241)
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FO-PLP transfer robot (SR9188)
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AC servo amps & motors (S-FLAG dynamic motion series)
Event Details
- Dates: Wednesday, March 26 – Friday, March 28, 2025
- Venue: Shanghai New International Expo Centre
- Booth: E7861
For more information, visit the SEMICON China information website.
