Rapidus Corporation and IBM have announced a new joint development partnership focused on establishing mass production technologies for chiplet packages, representing a significant step forward in semiconductor innovation.
This agreement builds on the two companies’ existing collaboration on 2nm node technology development. The partnership will involve IBM providing Rapidus with packaging technology for high-performance semiconductors. Engineers from both companies will collaborate at IBM’s North American facilities to conduct research and development, as well as manufacturing for semiconductor packaging used in high-performance computer systems.
The project aligns with the “Development of Chiplet and Package Design and Manufacturing Technology for 2nm-Generation Semiconductors,” supported by Japan’s New Energy and Industrial Technology Development Organization (NEDO). IBM brings extensive experience in semiconductor packaging R&D and manufacturing, including established partnerships with Japanese semiconductor manufacturers. Rapidus plans to leverage this expertise to accelerate its chiplet packaging technology.
Dr. Atsuyoshi Koike, President and CEO of Rapidus, noted, “Building on our current joint development agreement for 2nm semiconductor technology, we are extremely pleased to officially announce today this partnership with IBM to establish chiplet packaging technology. We will make the most of this international collaboration, and pursue initiatives that will allow Japan to play an even more important role in the semiconductor packaging supply chain.”
Darío Gil, SVP and Director of Research at IBM, stated, “With decades of innovation in advanced packaging, IBM is honored to expand our collaboration with Rapidus to develop state-of-the-art chiplet technology. Through our agreement, we are committed to supporting the development of the most advanced node production processes, design, and packaging, as well as developing new use cases and supporting the semiconductor workforce.”
This collaboration represents a significant advancement in semiconductor technology and is poised to contribute to the advancement of high-performance computing. The partnership leverages the strengths of both companies, aiming to drive innovation and efficiency in the industry.
