Intel Foundry Direct Connect 2025 Highlights Advancements in Process Technology and Packaging
Intel recently hosted its Intel Foundry Direct Connect event in San Jose, California, bringing together over 1,000 customers and ecosystem partners. The event showcased the company’s progress in process technology, advanced packaging, and ecosystem partnerships.
Process Technology Advancements
Intel CEO Lip-Bu Tan opened the event, discussing Intel Foundry’s progress and priorities. The company has engaged with lead customers on the Intel 14A process technology and distributed an early version of the Intel 14A Process Design Kit (PDK). Intel 14A will feature PowerDirect direct contact power delivery, building on the PowerVia backside power delivery technology in Intel 18A.
Advanced Packaging Innovations
Intel Foundry is advancing its packaging technology with innovations like EMIB-T and new additions to the Foveros architecture, including Foveros-R and Foveros-B. These advancements enable more efficient and flexible options for customers, particularly for future high-bandwidth memory needs.
Ecosystem Partnerships
The event highlighted Intel’s collaborations with ecosystem partners, including Synopsys, Cadence, Siemens EDA, and PDF Solutions. These partnerships are crucial for delivering a comprehensive portfolio of IP, EDA, and design services solutions to foundry customers.
Manufacturing Progress
Intel’s Fab 52 in Arizona has successfully processed its first wafer, marking a significant milestone in domestic UCR manufacturing. Additionally, Intel 18A volume production will begin in Intel’s Oregon fabs, with Arizona manufacturing ramping later this year.
The event underscored Intel’s commitment to building a world-class foundry that serves the growing need for leading-edge process technology, advanced packaging, and manufacturing. As Intel CEO Lip-Bu Tan stated, “Our No. 1 job is to listen to our customers and earn their trust by creating solutions to enable their success.”
