Nidec Advance Technology Corporation will present its latest advancements at SEMICON Japan 2024, scheduled to take place at the Tokyo International Exhibition Center from December 11th to 13th, 2024.
At the exhibition, the company will showcase a range of solutions. These include:
- Power semiconductor inspection equipment for IGBT/SiC modules
- Drive motor test benches designed for EVs, HEVs, and other vehicles
- Probe cards (jigs for wafer inspections)
- Other advanced technologies
The company will also feature the GATS Series, an electrical inspection system for semiconductor package substrates, and optical inspection equipment for 2D and 3D measurements of tiny bumps. These products highlight Nidec Advance Technology’s core measurement technologies. The company aims to present state-of-the-art inspection solutions and new products and technologies that drive future development.
About SEMICON Japan 2024
- Dates: Wednesday, December 11 – Friday, December 13, 2024
- Venue: East Exhibition Hall, Tokyo Big Sight
- Booth: 2Hall 2011
- Official Website: https://www.semiconjapan.org/en/
Nidec Advance Technology’s Exhibit Highlights
Nidec Advance Technology’s exhibits will include:
- NATS-1000/1700 Series (insulation, static and dynamic characteristics inspection equipment for IGBT and SiC modules)
- TDAS Series (test bench for EV drive motors)
- RWi Series (an automatic wafer bump inspection system)
- GATS Series (an electrical inspection system for semiconductor package substrates)
- R-700 Series (an AC/DC multi-tester)
- Probe cards for semiconductor wafer inspections
- Pin probes for ultra-high-precision inspections
- NATS-1300 Series (KGD testing equipment)
- NATS-8000 Series (dynamic reliability testing equipment for power semiconductor modules)
- Reference inverters
- NSW Series (3D optical inspection equipment)
