Nidec Advance Technology Corporation (“Nidec Advance Technology”) will be exhibiting at SEMICON China 2025, a major industry event taking place at the Shanghai New International Expo Centre from March 26-28, 2025.
This trade show, one of the largest of its kind in China, will feature products and services spanning the entire semiconductor supply chain, from chip design and manufacturing to packaging, testing, and materials. With over 1,000 companies expected to attend and more than 4,500 booths, SEMICON China 2025 promises to be a significant event for the industry.
Focusing on the theme of “Wafer Testing and Wafer Handling,” Nidec Advance Technology and Nidec Instruments Corporation (“Nidec Instruments”) will jointly present their latest innovations. These include optical visual inspection equipment and probe cards for wafer manufacturing from Nidec Advance Technology, alongside transfer robots developed by Nidec Instruments.
Nidec Advance Technology will showcase a range of products, including:
- Optical 2D/3D inspection equipment for semiconductor wafers (RWi300MK series)
- IGBT/SiC power module inspection equipment (NATS series)
- Conduction/short-circuit inspection equipment for semiconductor packages (GATS series)
- Optical 2D/3D inspection equipment for high-density substrates (RSH series)
- Semiconductor wafer inspection probe cards
- Semiconductor wafer transfer robot (SR8220, SR8241)
- FO-PLP transfer robot (SR9188)
- AC servo amps & motors (S-FLAG dynamic motion series)
Event Details:
- Dates: Wednesday, March 26 – Friday, March 28, 2025
- Venue: Shanghai New International Expo Centre
- Booth: E7861
