System Technology Co-optimization for Advanced Integration
Advanced integration and packaging are poised to revolutionize the scaling of computing systems in the coming decade. The emergence of systems with diverse performance characteristics, costs, and scales necessitates a shift toward system technology co-optimization (STCO). This approach is critical for developing the integration technologies that will define future systems. STCO must comprehensively address not only integration technologies, circuits, architectures, and software, but also their complex interactions with power delivery, cooling solutions, and overall system expenses.
This review provides a comprehensive perspective on the requirements of these STCO methodologies, showcasing illustrative case studies that highlight the current state of the art and provide insights into future directions.
Key Drivers and Technological Enablers
The primary factors driving the adoption of advanced integration techniques in emerging computing systems are connectivity, scalability, cost considerations, and form factor constraints. To facilitate advanced packaging, it is crucial to support technology heterogeneity, as well as advanced power delivery and effective cooling mechanisms.
STCO Approaches: A Classification
STCO strategies can be categorized into three primary levels: link level, component level, and cross-stack system level. Although automated and rapid cross-stack STCO frameworks are in their early stages, they are essential for guiding the development of high-value technologies.
